The Basic Structures, Electronic Symbols,
Working and Characteristic of Power Semiconductor Devices
1. Power Diode
2. Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)
3. Bipolar -Junction Transistor (BJT)
4. Insulated-Gate Bipolar Transistor (IGBT)
5. Thyristors (SCR, GTO, MCT)
1. Power Diode
2. Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET)
3. Bipolar -Junction Transistor (BJT)
4. Insulated-Gate Bipolar Transistor (IGBT)
5. Thyristors (SCR, GTO, MCT)
Solid-state devices are completely
made from a solid material and their flow of charges is confined within this
solid material. This name “solid state” is often used to show a difference with
the earlier technologies of vacuum and gas-discharge
tube devices; and also to exclude the conventional
electro-mechanical devices (relays, switches, hard drives and other
devices with moving parts).
The transistor by Bell Labs in 1947
was the first solid-state device to come into commercial use later in the
1960s. In this article, similar solid-state devices such as power diode, power
transistor, MOSFET, thyristor and its two-transistor model, triac, gate
turn-off thyristor (GTO), insulated-gate bipolar transistor (IGBT) and their
characteristics (such as i-v characteristics and turn-off characteristics) is
also presented. In power electronics circuitry, these switches act in
saturation region and work in linear region in the analog circuitry such as in
power amplifiers and linear regulators. This makes these switches highly
efficient since there are lesser losses during the power processing.
1. Power Diode
I. Basic Structure

I. Basic Structure
II.
Symbol of Power Diode
III. Working of Power Diode
Power diode is two terminal semiconductor device, with two terminals anode (A) and cathode (C).
If anode (A) terminal having higher potential than cathode (K) terminal , the power diode is forward biased and forward current flows from anode (A) to cathode (K). Voltage drop across diode during forward biased is 0.7 to 1V. If cathode (K) terminal having higher potential than anode(A) terminal, the power diode is reverse biased and device will not conduct and very small current flows through the device is called leakage current.
IV. VI Characteristics of Power Diode
V. Reverse Recovery Characteristics of Power Diode
Time Ta:
Charges stored in the depletion layer removed.
Time Tb:
Charges from the semiconductor layer is removed.
Shaded area in
Fig (a), represents stored charges QR which must be removed
during reverse-recovery time trr.
Power loss
across diode = Vf * If
As shown, major
power loss in the diode occurs during the period tb. Recovery can be
abrupt or smooth as shown in figure. To know it quantitatively, we can use the
S – factor.
Softness factor
or S-factor = Tb / Ta
S-factor is the measure
of the voltage transient that occurs during the time the diode recovers.
S-factor = 1 ⇒ low oscillatory
reverse-recovery process. (Soft –recovery diode)
S-factor <1 ⇒
large oscillatory over voltage (snappy-recovery diode or fast-recovery diode).
Power diodes now
exist with forward current rating of 1A to several thousand amperes with
reverse-recovery voltage ratings of 50V to 5000V or more.
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